АНАЛИЗ НА ТЕХНОЛОГИЧНИТЕ ОСОБЕНОСТИ ПРИ АСЕМБЛИРАНЕ И ЗАПОЯВАНЕ НА ПЕЧАТНАТА ПЛАТКА

dc.contributor.authorАнгелов, Пламен
dc.date.accessioned2025-03-13T13:37:34Z
dc.date.issued2020
dc.description.abstractIn the production of a printed circuit board (PCB) there are basic standardized norms that must be observed, especially in cases where this board will be prototyped. The different ways of assembling the components and the way of wiring have a significant impact on the production technology. After completion of the design, the assembly and soldering processes of the printing module must be observed. As it turns out, not everything ends with the production of the printed circuit board. Prototyping is followed by assembly and soldering of electronic components. This is a process of carefully arranging, attaching, and soldering the intended components.
dc.identifier.issn1311-221X
dc.identifier.urihttp://research.bfu.bg:4000/handle/123456789/747
dc.language.isobg
dc.publisherБургаски Свободен Университет
dc.relation.ispartofseriesvol. XLII; p.164
dc.subjectprinted circuit board
dc.subjectassembly
dc.subjectsoldering of electronic components
dc.titleАНАЛИЗ НА ТЕХНОЛОГИЧНИТЕ ОСОБЕНОСТИ ПРИ АСЕМБЛИРАНЕ И ЗАПОЯВАНЕ НА ПЕЧАТНАТА ПЛАТКА
dc.title.alternativeANALYSIS OF THE TECHNOLOGICAL FEATURES IN THE ASSEMBLY AND SOLDERING OF THE PRINTED CIRCUIT BOARD
dc.typeArticle

Files

Original bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
13_АНАЛИЗ НА ТЕХНОЛОГИЧНИТЕ ОСОБЕНОСТИ ПРИ.pdf
Size:
441.78 KB
Format:
Adobe Portable Document Format

License bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed to upon submission
Description: