АНАЛИЗ НА ТЕХНОЛОГИЧНИТЕ ОСОБЕНОСТИ ПРИ АСЕМБЛИРАНЕ И ЗАПОЯВАНЕ НА ПЕЧАТНАТА ПЛАТКА
dc.contributor.author | Ангелов, Пламен | |
dc.date.accessioned | 2025-03-13T13:37:34Z | |
dc.date.issued | 2020 | |
dc.description.abstract | In the production of a printed circuit board (PCB) there are basic standardized norms that must be observed, especially in cases where this board will be prototyped. The different ways of assembling the components and the way of wiring have a significant impact on the production technology. After completion of the design, the assembly and soldering processes of the printing module must be observed. As it turns out, not everything ends with the production of the printed circuit board. Prototyping is followed by assembly and soldering of electronic components. This is a process of carefully arranging, attaching, and soldering the intended components. | |
dc.identifier.issn | 1311-221X | |
dc.identifier.uri | http://research.bfu.bg:4000/handle/123456789/747 | |
dc.language.iso | bg | |
dc.publisher | Бургаски Свободен Университет | |
dc.relation.ispartofseries | vol. XLII; p.164 | |
dc.subject | printed circuit board | |
dc.subject | assembly | |
dc.subject | soldering of electronic components | |
dc.title | АНАЛИЗ НА ТЕХНОЛОГИЧНИТЕ ОСОБЕНОСТИ ПРИ АСЕМБЛИРАНЕ И ЗАПОЯВАНЕ НА ПЕЧАТНАТА ПЛАТКА | |
dc.title.alternative | ANALYSIS OF THE TECHNOLOGICAL FEATURES IN THE ASSEMBLY AND SOLDERING OF THE PRINTED CIRCUIT BOARD | |
dc.type | Article |