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Please use this identifier to cite or link to this item: http://research.bfu.bg:8080/jspui/handle/123456789/990

Title: АНАЛИЗ НА ТЕХНОЛОГИЧНИТЕ ОСОБЕНОСТИ ПРИ АСЕМБЛИРАНЕ И ЗАПОЯВАНЕ НА ПЕЧАТНАТА ПЛАТКА
Other Titles: ANALYSIS OF THE TECHNOLOGICAL FEATURES IN THE ASSEMBLY AND SOLDERING OF THE PRINTED CIRCUIT BOARD
Authors: Ангелов, Пламен
Keywords: printed circuit board
assembly
soldering of electronic components
Issue Date: 2020
Publisher: Бургаски свободен университет, 8000 Бургас, ул. "Сан Стефано" №62
Citation: https://www.bfu.bg/uploads/pages/godishnik-2020.pdf
Series/Report no.: TOM XLII;с. 164-171
Abstract: In the production of a printed circuit board (PCB) there are basic standardized norms that must be observed, especially in cases where this board will be prototyped. The different ways of assembling the components and the way of wiring have a significant impact on the production technology. After completion of the design, the assembly and soldering processes of the printing module must be observed. As it turns out, not everything ends with the production of the printed circuit board. Prototyping is followed by assembly and soldering of electronic components. This is a process of carefully arranging, attaching, and soldering the intended components
URI: http://research.bfu.bg:8080/jspui/handle/123456789/990
ISSN: 1311-221X
Appears in Collections:2020

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