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Title: | АНАЛИЗ НА ТЕХНОЛОГИЧНИТЕ ОСОБЕНОСТИ ПРИ АСЕМБЛИРАНЕ И ЗАПОЯВАНЕ НА ПЕЧАТНАТА ПЛАТКА |
Other Titles: | ANALYSIS OF THE TECHNOLOGICAL FEATURES IN THE ASSEMBLY AND SOLDERING OF THE PRINTED CIRCUIT BOARD |
Authors: | Ангелов, Пламен |
Keywords: | printed circuit board assembly soldering of electronic components |
Issue Date: | 2020 |
Publisher: | Бургаски свободен университет, 8000 Бургас, ул. "Сан Стефано" №62 |
Citation: | https://www.bfu.bg/uploads/pages/godishnik-2020.pdf |
Series/Report no.: | TOM XLII;с. 164-171 |
Abstract: | In the production of a printed circuit board (PCB) there are basic standardized
norms that must be observed, especially in cases where this board will be prototyped. The
different ways of assembling the components and the way of wiring have a significant
impact on the production technology. After completion of the design, the assembly and
soldering processes of the printing module must be observed. As it turns out, not everything
ends with the production of the printed circuit board. Prototyping is followed by assembly
and soldering of electronic components. This is a process of carefully arranging, attaching,
and soldering the intended components |
URI: | http://research.bfu.bg:8080/jspui/handle/123456789/990 |
ISSN: | 1311-221X |
Appears in Collections: | 2020
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